He Tingbo
Director, Huawei
After US sanctions hit Huawei, China's 'chip queen' told staff in a 2019 letter that her chip unit was building a backup lifeline for Huawei and the whole country.
- Born
- 1969, Changsha, Hunan, China
- Now
- Board Director; President, Semiconductor Business Department, Huawei
- Studied
- Beijing University of Posts and Telecommunications
Interesting facts
- Before AI
Joined Huawei as an engineer in 1996, straight after a master's degree at Beijing University of Posts and Telecommunications.
zh.wikipedia.org - Early start
In 1998 she moved to Shanghai to build a wireless chip team from scratch, working on 3G chips.
english.elpais.com - Numbers
Was put in charge of Huawei's chip development in 2003 with a $400 million annual budget, the start of what became HiSilicon.
reuters.com - Turning point
When the US blacklisted Huawei in May 2019, she told staff that backup chips her team had built for years would be switched on overnight.
reuters.com - First
In 2026 she unveiled the Tau Scaling Law, Huawei's alternative to Moore's Law, saying it was used to design and mass-produce 381 chips in six years.
huawei.com
Career
- HuaweiBoard Director; President, Semiconductor Business Department1996 to now
Education
- Master's, Beijing University of Posts and Telecommunications